VIA Mobile-ITX Form Factor

VIA Mobile-ITX Form Factor on hand

VIA Mobile-ITX Form Factor on hand

VIA announced the Mobile-ITX form factor which is the industry’s most compact x86 CPU-on-module specification. 50% smaller than Pico-ITX, the Mobile-ITX measures just 6cm x 6cm. It employs a modularized design that includes a CPU module card and an I/O carrier board. The separation CPU module card and I/O Card provides greater flexibility for developers to bring to market ultra-compact and lightweight devices.

VIA Mobile-ITX Form Factor modular design

Mobile-ITX Key Features:

  • Ultra-compact 6cm x 6cm Board Size – Enables small footprint system designs reduces overall system costs.
  • Rich I/O Expansion – Support for complete range of I/O standards including USB, CRT, TTL LCD, PCIe, SPI, LPC, Video capture (or COM), SDIO, IDE, PS/2, SMB, GPIO, Audio, DVI, LVDS (by Transmitter).
  • VIA Processor Platform – Ultra low power consumption including passive (fanless) cooling enables more compact system designs.
  • Slimline 12W Power Supply – Saves system space, enables fanless silent PC designs due to its low heat characteristics, reduces overall system costs and enhances overall system reliability.