VIA Mobile-ITX Form Factor
December 2nd, 2009 by Sze | No Comments | Filed in Others
VIA announced the Mobile-ITX form factor which is the industry’s most compact x86 CPU-on-module specification. 50% smaller than Pico-ITX, the Mobile-ITX measures just 6cm x 6cm. It employs a modularized design that includes a CPU module card and an I/O carrier board. The separation CPU module card and I/O Card provides greater flexibility for developers to bring to market ultra-compact and lightweight devices.
Tags: Computer-on-Module, Mobile-ITX, VIA, VIA Mobile-ITX,









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