At the CES 2013, Lenovo unveiled its next flagship smartphone, the K900 powered by Intel’s mobile processor. The premium handset has a super-slim profile measuring just 6.9mm thin that makes it the thinnest among high-end Android smartphones, and it is housed in a stainless steel alloy and polycarbonate unibody. Instead of trading performance off for slim body, the K900 is built to deliver top performance.
Lenovo’s K900 the first smartphone to be boosted Intel’s new Atom Clover Trail+ platform for a smooth and fast performance. It features a large 5.5-inch Full HD 1080p touchscreen display with over 400ppi pixel density that is protected by Gorilla Glass 2. The Intel-Inside phone sports Sony’s 13 Megapixel Exmor BSI sensor, a F1.8 lens and dual LED flash for outstanding camera performance. Its front-facing camera has a 88-degree viewing angle for convenient self-photos and video calls. Of course, you can expect Bluetooth, WiFi, GPS connectivity, and the phone runs Android operating system.
Lenovo’s sleek, slim 5.5-inch K900 smartphone/phablet will be released in April in China.