VIA EPIA-T700 6x6cm Mobile-ITX computer-on-module

VIA EPIA-T700 6x6cm Mobile-ITX computer-on-module

· May 31st, 2010 · Comments Off on VIA EPIA-T700 6x6cm Mobile-ITX computer-on-module
VIA launches the EPIA-T700, the first to use the Mobile-ITX form factor that measures just 6cm x6 cm, making it the smallest x86 computer-on-module. The T700 is boosted by a fanless ...
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VIA Mobile-ITX Form Factor

· Dec 2nd, 2009 · Comments Off on VIA Mobile-ITX Form Factor
VIA announced the Mobile-ITX form factor which is the industry’s most compact x86 CPU-on-module specification. 50% smaller than Pico-ITX, the Mobile-ITX measures just 6cm x 6cm. ...
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Ampro RuffSystem 840 Extreme Rugged Embedded PC

· Aug 24th, 2009 · Comments Off on Ampro RuffSystem 840 Extreme Rugged Embedded PC
Ampro, part of Adlink, launches the RuffSystem 840, an Extreme Rugged embedded PC. The device meets the MIL-STD 810 standard, which means it is shock/vibration resistant and has the ...
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